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电子制造工程专业英语


作者:
金鸿
定价:
18.00元
ISBN:
978-7-04-032448-8
版面字数:
230.000千字
开本:
16开
全书页数:
144页
装帧形式:
平装
重点项目:
暂无
出版时间:
2011-08-15
读者对象:
高等职业教育
一级分类:
电子信息大类
二级分类:
电子信息类
三级分类:
微电子技术

本书旨在使读者掌握电子制造工程专业群的英语术语及用法,培养和提高读者阅读和翻译专业英语文献资料的能力,为今后获取和交流专业技术信息打下良好的基础。全书共18课,内容包括电的本质、电场、简单电路、半导体材料、电化学基础、光化学基础、电子封装、印制电路板成像、电镀技术、柔性电路、柔性电路的检测、显示技术简介、液晶显示、等离子显示、发光二极管、半导体器件及集成电路、半导体制造工艺、封装及测试等。每课由课文、语法(或翻译或应用文)和扩展阅读组成。本书还简单介绍了翻译知识,并配有适量的练习与扩展阅读材料,供教师选用及学生自学用。

本书内容新颖,图文并茂,浅显易学,可用作光电子技术、电子电路设计与工艺、微电子技术、光伏发电技术及应用等专业的专业英语教材或教学参考书,也可供从事电子制造工程类专业的工程技术人员学习参考。

  • Lesson One
    • Part Ⅰ Intensive Reading:The Nature of Electricity
    • Part Ⅱ Grammar:Parts of Speech
    • Part Ⅲ Extensive Reading:Why do We Get a Shock from Electricity?
  • Lesson Two
    • Part Ⅰ Intensive Reading:Electric Field, Potential and Voltage
    • Part Ⅱ Grammar:Prefix and Suffix
    • Part Ⅲ Extensive Reading:Electric Field and Electric Field Lines
  • Lesson Three
    • Part Ⅰ Intensive Reading:Simple Electric Circuit
    • Part Ⅱ Grammar:Word-Formation
    • Part Ⅲ Extensive Reading:DC Biasing—BJTs
  • Lesson Four
    • Part Ⅰ Intensive Reading:Semiconductor Material
    • Part Ⅱ Grammar:Word-activity
    • Part Ⅲ Extensive Reading:Growth of Semiconductor Materials
  • Lesson Five
    • Part Ⅰ Intensive Reading:Electrochemistry Basis
    • Part Ⅱ Grammar:Sentence Backbones
    • Part Ⅲ Extensive Reading:The History of Electrochemistry
  • Lesson Six
    • Part Ⅰ Intensive Reading:Photochemistry Basis
    • Part Ⅱ Grammar:Sentence Elements
    • Part Ⅲ Extensive Reading:Photolithography Introduction
  • Lesson Seven
    • Part Ⅰ Intensive Reading:Electronic Package and High-density Interconnectivity
    • Part Ⅱ Grammar:Complex Sentence Ⅰ
    • Part Ⅲ Extensive Reading:Electronic Packaging
  • Lesson Eight
    • Part Ⅰ Intensive Reading:Printed Circuit Board Imaging
    • Part Ⅱ Grammar:Complex sentence Ⅱ
    • Part Ⅲ Extensive Reading:HannStar Board-GBM Consolidation to Create Largest PCB Maker in Taiwan Province
  • Lesson Nine
    • Part Ⅰ Intensive Reading:Plated-Through-Hole(PTH)Technology
    • Part Ⅱ Translation Skills:Translation Standards and Process
    • Part Ⅲ Extensive Reading:The Disadvantages of Pattern Plating
  • Lesson Ten
    • Part Ⅰ Intensive Reading:Flexible Circuits
    • Part Ⅱ Translation Skills:Conversion of Part of Speech
    • Part Ⅲ Extensive Reading:Design of Flexible Circuits
  • Lesson Eleven
    • Part Ⅰ Intensive Reading:Inspection and Test of Flexible Circuits
    • Part Ⅱ Translation Skills:Translation of Complex Sentences in Scientific English
    • Part Ⅲ Extensive Reading:Printed Electronics Make PCB “Green Up”
  • Lesson Twelve
    • Part Ⅰ Intensive Reading:Introduction of Display Technology
    • Part Ⅱ Translation Skills:Amplification and Deletion
    • Part Ⅲ Extensive Reading:Flat Panel Buying Tips
  • Lesson Thirteen
    • Part Ⅰ Intensive Reading:Liquid Crystal Display
    • Part Ⅱ Practical Writing:Resume
    • Part Ⅲ Extensive Reading:High Luminance and Wide Color Gamut—for clear, vivid color
  • Lesson Fourteen
    • Part Ⅰ Intensive Reading:Plasma Display Panel
    • Part Ⅱ Practical Writing:Cover Letter
    • Part Ⅲ Extensive Reading:Full HD Plasma Panel Creates a True Full HD 3D World
  • Lesson Fifteen
    • Part Ⅰ Intensive Reading:Light Emitting Diodes
    • Part Ⅱ Practical Writing:Reference Letter
    • Part Ⅲ Extensive Reading:Organic Light Emitting Diodes
  • Lesson Sixteen
    • Part Ⅰ Intensive Reading:Semiconductor Devices and Integrated Circuits
    • Part Ⅱ Practical Writing:Advertisement
    • Part Ⅲ Extensive Reading:How Solar Cells Work?
  • Lesson Seventeen
    • Part Ⅰ Intensive Reading:Semiconductor Manufacturing Processes
    • Part Ⅱ Practical Writing:Self-Introduction
    • Part Ⅲ Extensive Reading:Photolithography
  • Lesson Eighteen
    • Part Ⅰ Intensive Reading:Packaging and Testing
    • Part Ⅱ Practical Writing:Work Report
    • Part Ⅲ Extensive Reading:Chip Scale Package
  • Reference

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